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NOIL1SN3000A
Mechanical Specifications
Table 52. MECHANICAL SPECIFICATIONS
Mechanical Specifications
Min
Typ
Max
Units
Die (Referenced to
Pin 1 being bottom left
in Figure 39 on page 52)
Glass lid specification
Mechanical shock
Vibration
Die thickness
Die center, X offset to the center of package
Die center, Y offset to the center of the package
Die position, X tilt
Die position, Y tilt
Die placement accuracy in package
Die rotation accuracy
Optical center referenced from the package center.
Optical center referenced from the package center.
Distance from PCB plane to top of the die surface
Distance from top of the die surface to top of the glass lid
X x Y size
Thickness
Spectral range for optical coating of window
Reflection coefficient for window
JESD22-B104C; Condition G
JESD22-B103B; Condition 1
–
–
–
–1
–1
–50
–1
–
–
–
–
–
–
400
–
–
20
750
0
0
0
0
0
0
–230
1450
2
2
28.2 x 19.5
1
–
–
2000
–
–
–
–
1
1
50
1
–
–
–
–
–
–
1100
<0.8
–
2000
m m
m m
m m
deg
deg
um
deg
m m
m m
mm
mm
mm
mm
nm
%
G
Hz
Mounting profile
Lead-free wave soldering profile for pin grid array package if no socket is used
Recommended socket
manufacturer
Andon Electronics ( http://www.andonelectronics.com )
http://onsemi.com
51
BGA socket: 10-21-06-369-414T4-R27-L14
Thru hole: 10-21-06-369-400T4-R27-L14
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